Thermalright CPU Contact Frame for LGA 1700 Retrofit Kit, 17XX-BCF Bracket Intel12 Generation
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Thermalright LGA1700-BCF 12th CPU Bending Corrector Frame Buckle Protector CPU Fixed Backplane Tools with Thermal Paste Screwdriver<br />
Description:<br />
Thermalright creates an anti-bend solution for Intel's Alder Lake processors<br />
Intel's Alder Lake processors are prone to flexing and warping, a flaw with the Intel LGA1700 CPU's latching system. In response to this problem, an anti-bend frame was developed, designed to prevent warping/bending of Alder Lake CPUs.<br />
The LGA1700-BCF, an aluminum frame that replaces the CPU mounting mechanism of the company's LGA1700 CPU socket. This frame fits around the processor and is secured with simple screws. The frame applies more even pressure to Intel's Alder Lake processors, reducing the chance of warping. However, Intel warns that this mounting solution could void your CPU warranty, so consumers should be aware of this.<br />
This LGA 1700 Anti-Bend Buckle adopts an all-aluminum CNC gold anodized sandblasting process, with an overall size of 70 x 54 x 6 mm and an overall weight of 55g. Its precise positioning can avoid the capacitors on the motherboard, and uses the original LOTES insulation protection pads, and also provides different color schemes<br />
Compared with the previous home-made brackets, this LGA 1700 anti-bending buckle is much more comprehensive in design and better quality. What's more, the price is very affordable. Z690, B660 and H610 motherboards can use this LGA 1700 anti-bending clip<br />
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Feature:<br />
Only provides support for Intel 12th generation CPU, the motherboard CPU socket is LGA1700, and the chipset is H610 B660 Z690 series. <br />
The original buckle is used, and the buckle force point is in the middle of the CPU, and the support point of the CPU cover will be worn to a certain extent.<br />
All aluminum alloy is used. CNC precision manufacturing, anodized sandblasting, multi-color optional<br />
Precise positioning Avoid capacitors and use LOTES original insulation protection pads of the same specification<br />
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Specification:<br />
Name: CPU Anti-Bending Frame<br />
Material: aluminum alloy<br />
Color: black, gray, red, Blue (optional)<br />
Applicable: Only provide support for Intel 12th generation CPU, the motherboard CPU socket is LGA1700, and the chipset is H610 B660 Z690 series<br />
Size: Length 54mm Width 70mm Height 6mm/2.13*2.76*0.24''<br />
Weight: main body 20g; overall 55g<br />
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Note:<br />
Due to the different monitor and light effect, the actual color of the item might be slightly different from the color showed on the pictures. Thank you!<br />
Please allow 1-2cm measuring deviation due to manual measurement.
Included:
1 X CPU Bending Corrector<br />
1 X <span class='VIiyi><span class='JLqJ4b ChMk0b><span class='Q4iAWc>L-shaped Screwdriver<br />
1 X <span class='VIiyi><span class='JLqJ4b ChMk0b><span class='Q4iAWc>TF7 2g Thermal Paste</span></span></span></span></span></span><br />
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Compatible With: The cpu contact frame is a replacement for the original buckle, not a radiator buckle. Fully fit Intel12 /13 Generation LGA1700 CPU,
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Kompatibel mit: Die CPU Bending Correction Fixed Buckle ist ein Ersatz fr die Original-Schnalle, keine Khler-Schnalle. Vollstndig passend fr Intel12 Generation LGA1700 CPU, Chipsatz H610, B660, Z690 Serie. Anti-Warping: Die CPU des Computers ist anfllig fr berhitzung und Verziehen. Der feste Rahmen des CPUs wurde entwickelt, um ein Verziehen und Biegen der CPU zu verhindern.
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