CoolerCube Thermal Paste, 3g CPU Thermal Compound Paste, Heatsink Paste for All Coolers, CPU, GPU, IC Processor, Carbon Based High Performance, Thermal Interface Material : Electronics

Descripción

CoolerCube Pasta térmica, 0.11 oz de pasta compuesta térmica de CPU, pasta disipadora de calor para todos los enfriadores, CPU, GPU, procesador IC, alto rendimiento basado en carbono, material de interfaz térmica : Electrónica

EXCELLENT THERMAL CONDUCTIVITY:Thermal Paste conductivity 1.93 W/mk. It ensures that the heat generated by the CPU or GPU is effectively

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Thermal Paste, 3g CPU Paste Thermal Compound Paste Heatsink for IC/Processor/CPU/All Coolers, Carbon Based High Performance, Thermal Interface

CoolerCube Thermal Paste, 3g CPU Thermal Compound Paste, Heatsink Paste for All Coolers, CPU, GPU, IC Processor, Carbon Based High Performance, Thermal Interface Material : Electronics

€ 6.00EUR
puntaje 4.9(235)
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